TTTC's
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2nd IEEE
Workshop on Design for Reliability and Variability Held in Conjunction with ITC Test Week (ITC 2009) |
CALL
FOR PAPERS |
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As silicon based CMOS technologies are fast approaching their ultimate limits, reliability is threatened by issues such as process, voltage and temperature variability, accelerated aging and wearout, radiation induced soft-errors and cross talk. In particular, variability of process, voltage and temperature represent a significant threat not only for parametric yield but also for reliability, since they induce timing faults that are extremely difficult to detect during manufacturing testing. It results on increasing ratio of circuits passing fabrication test that are susceptible to manifest failures in the field. These problems are creating barriers to further technology scaling and are forcing the introduction of new process, design and test solutions aimed at maintaining acceptable levels of reliability. As elimination of these issues is becoming increasingly difficult, various design techniques are emerging to circumvent them. These techniques may incur area, power, yield or performance penalties. Thus, to enable their adoption by the industry there is need for novel solutions to minimize penalties and provide automation tools. Representative topics include, but are not limited to:
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To present at the Workshop, authors are invited to submit previously unpublished technical proposals. The proposals may be draft presentations, extended abstracts (500 words), or full papers. Each submission should include: title, full name and affiliation of all authors, a short abstract of 50 words, and keywords. Also, identify a contact author and include a complete correspondence address, phone number, fax number, and e-mail address. Submit a copy of your proposal by PDF, via E-mail to : drvw2009@auburn.edu Proposals for panel discussions are also invited. Submissions are due no later than August 30, 2009. Authors will be notified of the disposition of their presentation by September 27, 2009. Authors of accepted presentations must submit the final presentation by October 15, 2009 for inclusion in the Workshop Proceedings, which will be provided to the attendees on a memory stick. Optionally, an extended abstract or paper can also be included in the notes. |
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Submission deadline: August 30, 2009 |
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Additional Information | |||||
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Committees | |||||
General Chairs Vice General Chair Vice Program Chairs Finance Chair: Publicity Chair: Panels Chair Publications Chair: |
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For
more information, visit us on the web at: TBA |
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The 2nd IEEE Workshop on Design for Reliability and Variability (DRV 2009) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC). |
IEEE
Computer Society- Test Technology Technical Council |
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